The next phase of digital transformation has come, according to the firm's Consultative Consortium, which uses billions of devices and objects connected by progressive sensors to collect and transmit data, reaching the very end of the network.
A new wave of innovation extends digital intelligence to areas beyond proprietary devices such as personal computers, tablets and smartphones. If a device's power performance is excellent, it can become an IoT or an intelligent networking node in any automation system such as connected car, wearable technology, smart building and city.
Many people think that these phenomena are essentially digital. After all, the Internet of Things is a network of billions of data points that can be gathered in the cloud and processed and analyzed with sophisticated software. But the heart of these changes is sensors, ubiquitous devices that measure and characterize physical phenomena such as light, heat, motion and sound and anchor 1 and 0 representations in the digital network to the real world.
Although sensors existed in some form prior to the invention of silicon-based chips, today's sensors are growing at an unprecedented rate in order to support the expansion of billions of new devices. New sensing technologies are driving innovative applications such as 3D optical sensing technology for consumer and mobile applications, time-of-flight (ToF) measurements for reliable camera autofocus and image correction, high-end for Industrial 4.0 control Machine vision, high-resolution imaging for medical diagnostics, auto-tuning of buildings, automatic / driverless cars, and 24-hour personal health monitors.
Grasp the realization of the entire sensor system
With the rapid development of sensor technology, sensor nodes have spread all over the lighting equipment, clothing, food packaging, and even placed inside the body or embedded in the skin, but they must meet some new challenging requirements:
Extremely miniaturized
Ultra-low power consumption
The ability to connect to the network
Application - to handle signal or data output
In addition, these next-generation sensors must be suitable for manufacturers of all types of "things," including lighting, drug delivery, door locks, meters and traditional electronics. In many cases, manufacturers are looking for more than just sensors with different capacitances, resistances or output voltages; they also need a "plug and play" sensor system that can be easily connected to the network and connected to a processor or Such as smart phones and other paired host connected.
These high-performance sensor nodes designed for digital transformation typically consist of three separate technology layers:
Core sensor layer: The core sensor layer is an electronic representation of real-world phenomena such as image, optical, ambient or audio.
Miniaturization and integration layer: The miniaturization and integration layer is chip-scale or modular (multi-chip package) on silicon-based core sensing technology. This layer also provides algorithms for converting raw sensor measurements into linear signal streams for use by the processor.
System technology layer: The system technology layer is software embedded in sensors that connect to public networks, such as Bluetooth Low Energy and Wi-Fi technologies. Sensor system software also supports end-user applications such as converting optical sensor signals in smart wristbands to measurements of heartbeats per minute. In the next generation of sensor systems, each layer of technology includes hardware and software packaged in one package with end-product manufacturers. These miniature networked sensors are easy to integrate into applications, and therefore are critical to the continued expansion of these devices.
Break the performance limits
Digital transformation is more than a matter of embedding more sensors in more types of devices. In addition, digital transformation has also been underway as sensor manufacturers such as ams are breaking the boundaries of sensor performance. These breakthroughs enable product manufacturers to significantly improve the user experience and even create entirely new and previously impossible experiences.
Here are some examples of the revolutionary changes that sensors use in new applications:
New XYZ color sensor chips:
The new XYZ color sensor chip in mobile phones, tablets and laptops can "see" the color of light and simulate the human eye's response to the "red", "green" and "blue" light receptors. With a color sensor chip, a new generation of paper screens looks more natural than existing mobile device displays, and is likely to happen. In addition to these color sensors, ultra-high-sensitivity proximity (infrared) sensors enable seamless front panel fabrication.
Multi-spectral and hyper-spectral sensor ICs:
Multispectral and Hyperspectral Sensor ICs are lab-level, chip-scale spectrometers. With them, it is expected for the first time accurate food color detection and quality analysis. With the spectrum sensor chip, the color analysis capabilities of mobile devices will also change the testing and quality analysis processes in factories and hospitals. CMOS image sensors have also found an important use in industrial applications including machine vision.
Active noise cancellation (ANC):
Active Noise Cancellation (ANC) is being used in the design of innovative audio headsets with integrated sensor / amplifier solutions. For the first time, headphone makers have adopted ANCs for in-ear headphones and wireless headphones, thanks to the small size and low power consumption of ANC devices.
3D imaging systems-on-a-chip:
The chip-level 3D imaging system promises to change the applications of virtual reality (VR) and augmented reality (AR) while dramatically improving gesture awareness, face scanning and 3D modeling. The new solution takes advantage of innovations in laser design, optical packaging, and structural light perception.
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